Professor Yair Ein-Eli

  • B.A. 1990 (Bar-Ilan University)

After graduating from Bar-ilan University in 1995, Dr. Ein-Eli was a post doctoral fellow at Covalent Associates Inc located at MA, U.S.A. (1995-1997), where he eventually headed the Li-ion research group until 1998. He then proceeded and joined Electric Fuel Ltd. and was appointed Director of Research and Battery Technology. In 2001 he joined the Department of Materials Science & Engineering at the Technion. He is the current President of the Israeli Corrosion Forum (NACE Israel), member of the Israel Chemical Society, and a member of the Electrochemical Society and the International Society of Electrochemistry.

Silicon electrochemistry

Electrochemical etching of both n-and p-type silicon under cathodic bias is performed in our laboratory. We term this Process Negative Potential Dissolution (NPD). This technique can be used for three dimensional fabrications, as an alternative to other etching techniques. NPD studies include the understanding of the specific mechanism, features of electrochemical texturing (from polished surfaces to pyramidal or invert pyramidal texturing), potential biasing and the influence of electrolytes.

Zinc electrochemistry

Zinc is the metal of choice in alkaline battery industry because of its valuable characteristics such as high theoretical capacity of 820 Ah/kg, high half cell potential and the fact that it is environmentally a benign material. However the zinc metal undergoes anodic dissolution accompanying with a cathodic evolution of hydrogen in aqueous alkaline media. Therefore, the focus of our group is aimed at developing organic inhibitors which will be environmentally benign and still will not influence the electrochemical performance of the alkaline cell.

Copper electrochemistry

In the last years copper is evaluated as a replacement for aluminum in integrated circuit interconnections. The use of copper metallization instead of aluminum introduces several advantages. An important process is the surface planarization until copper is left only in the trenches and vias recessed into the ILD. The planarization technique should leave the surface ideally planar removing copper from outside of ILD.

Microbiologically influenced corrosion (MIC)

Microbiologically influenced corrosion (MIC) has been recognized by the engineering community, as a significant factor in reducing the useful lifetime of equipment. The most significant case of MIC is associated with activity of sulphate reducing bacteria (SRB).  Although SRB is the most extensively studied group of bacteria in MIC field, the mechanism of metallic corrosion induced by this type of microorganisms is still unknown. Understanding the causes leading to drastic corrosion of various metallic equipments made of mild and stainless steels, copper and its alloys, aluminum and its alloys, in SRB infected media will allow the society to better combat this problem


  • Advanced materials for portable power sources
  • Electrochemical behavior and electrodepositing of copper
  • Chemical Mechanical Planarization (CMP) of copper interconnects
  • Electrochemical behavior of silicon

PUBLICATIONS LIST 2002-PRESENT (on group site)